Tantalum Sputtering Targets
Tantalum Sputtering Targets are made from tantalum of the highest purity, ensuring a consistent and reliable composition. The high density of the material increases sputtering efficiency and improves film adhesion. The low content of impurities and gases in tantalum enables excellent film quality and uniformity. The melting point of tantalum is 2980 ℃, and the density is 16.68g/cm³.
DESCRIPTION
Tantalum(Ta) is one of the rare, hard, blue gray, and highly corrosion-resistant refractory metals. The melting point of tantalum is 2980 ℃, and the density is 16.68g/cm³. Tantalum has a series of excellent properties, including high melting point, low vapor pressure, good cold working performance, high chemical stability, strong resistance to liquid metal corrosion, and large dielectric constant of surface oxide film. Tantalum targets are mainly used in semiconductor coating, optical coating, flat panel displays, optical information storage space industries, glass coating industries such as automotive and architectural glass, optical communication, etc.
Tantalum Sputtering Targets are made from tantalum of the highest purity, ensuring a consistent and reliable composition. The high density of the material increases sputtering efficiency and improves film adhesion. The low content of impurities and gases in tantalum enables excellent film quality and uniformity. In addition, the material is easy to process and can be precisely molded to meet specific application requirements. Their adaptability and reliability make them an important part of many sputter deposition processes.
| Physical parameters | ||||||||||
| Shape | Planar and rotary targets with any shape | |||||||||
| Purity | 4N4 | Relative density | >99% | |||||||
| Surface roughness(um) | Ra<1.6 | Grain size(um) | <100 | |||||||
| Chemical Composition, ppm wt | ||||||||||
| Ta | C | O | N | H | Nb | Fe | Si | |||
| ≥99.994% | 5 | 6.8 | 7.8 | 3 | 50 | 0.01 | 0.01 | |||
| W | Ni | Mo | Al | Cu | Ti | Others | - | |||
| 3.3 | 0.01 | 1.1 | 0.03 | 0.07 | 0.01 | 1.6 | - | |||
The important details of tantalum targets
Microstructure of a tantalum target from Advanced Targets
Tantalum has a wide range of applications due to its properties. Tantalum can be used as a substitute for stainless steel in equipment for producing various inorganic acids, and its service life can be dozens of times longer than stainless steel. In the chemical, electronic, and electrical industries, tantalum can replace the tasks previously undertaken by platinum, greatly reducing costs. Tantalum can also be used to manufacture evaporators, electrodes, rectifiers, and electrolytic capacitors for electronic tubes. Thin sheets and threads made of tantalum can be used medically to repair damaged tissues.
Tantalum targets are mainly used in semiconductor coating, optical coating, flat panel displays, optical information storage space industries, glass coating industries such as automotive and architectural glass, optical communication, etc. For example, using physical vapor deposition (PVD) technology, tantalum targets are "sputtered" onto semiconductor substrates to form thin film diffusion barriers to protect copper interconnects. Tantalum sputtering targets are also used in various other products, including magnetic storage media, inkjet printer heads, and flat panel displays.
Adding other elements to tantalum can form different types of alloy targets, such as tantalum-silicon targets, tantalum-aluminum targets, tantalum-tungsten targets, nickel-tantalum targets, cobalt-zirconium-tantalum targets, tantalum-nitride targets, tantalum-carbide targets, tantalum-borate targets, tantalum-pentoxide targets, and other sputtering targets.
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