Semiconductor Wafer Sputtering Targets

Semiconductor wafer sputtering targets are the key consumables for depositing metal/alloy thin films on silicon wafers through the magnetron sputtering (PVD) process. Their material purity (up to 99.9999%) and grain orientation (<111>/<100>) directly affect the conductivity and reliability of the interconnect and barrier layers.

We provide high-purity, precisely engineered sputtering targets designed to meet the rigorous standards of the semiconductor industry. Our products support applications ranging from R&D and pilot production to full-scale manufacturing.

Key Features

Ultra-High Purity Materials

Purity levels up to 99.999% minimize contamination, ensuring the integrity of deposited films in high-performance semiconductor applications.

Excellent Microstructure Control

Our targets feature homogeneous grain structure for uniform sputtering rates and optimal thin-film characteristics.

Dimensional Accuracy & Surface Quality

Each target is machined to tight tolerances and finished with a smooth or mirror-polished surface to ensure compatibility with modern PVD systems.

Bonded and Non-Bonded Options

Targets are available as bonded (with backplates) or monolithic, depending on your system and thermal requirements.

Wide Range of Material Options

Including but not limited to:

Pure Metals: Aluminum (Al), Copper (Cu), Tantalum (Ta), Tungsten (W), Titanium (Ti), Molybdenum (Mo), etc.

Alloys: AlSi, AlTi, TiW, TaNb

Compounds: Titanium Nitride (TiN), Tantalum Nitride (TaN), Indium Tin Oxide (ITO), and more.

Applications of Our Wafer Sputtering Targets

IC/Chip Fabrication

MEMS Devices

RF Components

Thin Film Transistor (TFT) Production

Packaging and Interconnect Layers

Optoelectronic DevicesStandard & Customized Options

Who We Serve

• Semiconductor foundries (Fabless & IDM)

• Research institutes and universities

• Semiconductor equipment manufacturers

• Thin-film coating companies

• R&D labs and prototyping centers